Kyle Whitten — 4 Patents at Macdermid Enthone

Issued Patents 2021

Showing 1–4 of 4 patents

Patent #	Title	Co-Inventors	Date
11168406	Leveler compositions for use in copper deposition in manufacture of microelectronics	Vincent Paneccasio, Jr., Thomas B. Richardson, Ivan Li	2021-11-09
11124888	Copper deposition in wafer level packaging of integrated circuits	Thomas B. Richardson, Vincent Paneccasio, Jr., John Commander, Richard Hurtubise	2021-09-21
11035048	Cobalt filling of interconnects	John Commander, Vincent Paneccasio, Jr., Shaopeng Sun, Eric Yakobson, Jianwen Han +1 more	2021-06-15
10995417	Cobalt filling of interconnects in microelectronics	John Commander, Vincent Paneccasio, Jr., Eric Rouya, Shaopeng Sun, Jianwen Han	2021-05-04