Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11168406 | Leveler compositions for use in copper deposition in manufacture of microelectronics | Kyle Whitten, Thomas B. Richardson, Ivan Li | 2021-11-09 |
| 11124888 | Copper deposition in wafer level packaging of integrated circuits | Thomas B. Richardson, Kyle Whitten, John Commander, Richard Hurtubise | 2021-09-21 |
| 11035048 | Cobalt filling of interconnects | John Commander, Kyle Whitten, Shaopeng Sun, Eric Yakobson, Jianwen Han +1 more | 2021-06-15 |
| 10995417 | Cobalt filling of interconnects in microelectronics | John Commander, Eric Rouya, Kyle Whitten, Shaopeng Sun, Jianwen Han | 2021-05-04 |