Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11193015 | Thermosetting resin composition for semiconductor package and prepreg using the same | Hwayeon Moon, Changbo SHIM, Hyunsung Min, Won Ki Kim | 2021-12-07 |
| 11091630 | Resin composition for semiconductor package, prepreg, and metal clad laminate using the same | Chang Bo Shim, Hyun Sung Min, Young-chan Kim, Seung Hyun Song | 2021-08-17 |
| 10913849 | Resin composition for semiconductor package, and prepreg and metal clad laminate using the same | Chang Bo Shim, Hyun Sung Min, Hwa Yeon Moon, Seung Hyun Song, Yong Seon Hwang | 2021-02-09 |