Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11091630 | Resin composition for semiconductor package, prepreg, and metal clad laminate using the same | Hee Yong Shim, Hyun Sung Min, Young-chan Kim, Seung Hyun Song | 2021-08-17 |
| 10913849 | Resin composition for semiconductor package, and prepreg and metal clad laminate using the same | Hee Yong Shim, Hyun Sung Min, Hwa Yeon Moon, Seung Hyun Song, Yong Seon Hwang | 2021-02-09 |