Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10913849 | Resin composition for semiconductor package, and prepreg and metal clad laminate using the same | Chang Bo Shim, Hee Yong Shim, Hyun Sung Min, Hwa Yeon Moon, Seung Hyun Song | 2021-02-09 |