Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11193015 | Thermosetting resin composition for semiconductor package and prepreg using the same | Hwayeon Moon, Changbo SHIM, Hee Yong Shim, Hyunsung Min | 2021-12-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11193015 | Thermosetting resin composition for semiconductor package and prepreg using the same | Hwayeon Moon, Changbo SHIM, Hee Yong Shim, Hyunsung Min | 2021-12-07 |