Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11193015 | Thermosetting resin composition for semiconductor package and prepreg using the same | Hwayeon Moon, Hee Yong Shim, Hyunsung Min, Won Ki Kim | 2021-12-07 |
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Changbo SHIM
Overall (2021): #495,431 of 548,734Top 95%
1
Patents 2021