Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075115 | Tungsten feature fill | Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang | 2021-07-27 |
| 11069535 | Atomic layer etch of tungsten for enhanced tungsten deposition fill | Chiukin Steven Lai, Keren Jacobs Kanarik, Samantha Tan, Teh-Tien Su, Wenbing Yang +2 more | 2021-07-20 |
| 10977405 | Fill process optimization using feature scale modeling | Michael J. Bowes, Atashi Basu, Kapil Sawlani, Dongyao Li, David M. Fried +1 more | 2021-04-13 |
| 10916434 | Feature fill with multi-stage nucleation inhibition | Deqi Wang, Raashina Humayun, Michal Danek | 2021-02-09 |