Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11174157 | Semiconductor device packages and methods of manufacturing the same | Chi-Sheng Tseng, Lu-Ming Lai, Yin Chen, Hsin-Lin WU, San Yu | 2021-11-16 |
| 11101189 | Semiconductor device package and method of manufacturing the same | Ming-Yen Lee, Chia-Hao Sung, Ching-Han Huang | 2021-08-24 |
| 11081413 | Semiconductor package with inner and outer cavities | Hsin-Lin WU, Chang Chin Tsai, Lu-Ming Lai, Ching-Han Huang | 2021-08-03 |