Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171108 | Semiconductor package and method for manufacturing the same | An-Nong Wen, Ching-Ho Chang | 2021-11-09 |
| 11133278 | Semiconductor package including cap layer and dam structure and method of manufacturing the same | Yu-Che Huang, An-Nong Wen, Po Ming Huang | 2021-09-28 |
| 11101189 | Semiconductor device package and method of manufacturing the same | Ming-Yen Lee, Chia-Hao Sung, Yu-Hsuan Tsai | 2021-08-24 |
| 11091365 | MEMS package structure and manufacturing method thereof | Lu-Ming Lai | 2021-08-17 |
| 11081413 | Semiconductor package with inner and outer cavities | Hsin-Lin WU, Yu-Hsuan Tsai, Chang Chin Tsai, Lu-Ming Lai | 2021-08-03 |
| 11014806 | Semiconductor device package and a method of manufacturing the same | Hsu-Liang Hsiao, Lu-Ming Lai, Chia-Hung Shen | 2021-05-25 |