Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171108 | Semiconductor package and method for manufacturing the same | Ching-Han Huang, Ching-Ho Chang | 2021-11-09 |
| 11133278 | Semiconductor package including cap layer and dam structure and method of manufacturing the same | Yu-Che Huang, Ching-Han Huang, Po Ming Huang | 2021-09-28 |