Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133278 | Semiconductor package including cap layer and dam structure and method of manufacturing the same | Yu-Che Huang, Ching-Han Huang, An-Nong Wen | 2021-09-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133278 | Semiconductor package including cap layer and dam structure and method of manufacturing the same | Yu-Che Huang, Ching-Han Huang, An-Nong Wen | 2021-09-28 |