Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11174157 | Semiconductor device packages and methods of manufacturing the same | Chi-Sheng Tseng, Lu-Ming Lai, Yu-Hsuan Tsai, Yin Chen, San Yu | 2021-11-16 |
| 11081413 | Semiconductor package with inner and outer cavities | Yu-Hsuan Tsai, Chang Chin Tsai, Lu-Ming Lai, Ching-Han Huang | 2021-08-03 |