Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11211536 | Semiconductor device package and a method of manufacturing the same | Mei-Yi Wu, Yu-Ying Lee, Yung-Yi Chang | 2021-12-28 | $1,576,000 |
| 11174157 | Semiconductor device packages and methods of manufacturing the same | Chi-Sheng Tseng, Yu-Hsuan Tsai, Yin Chen, Hsin-Lin WU, San Yu | 2021-11-16 | $3,120,000 |
| 11091365 | MEMS package structure and manufacturing method thereof | Ching-Han Huang | 2021-08-17 | $2,025,000 |
| 11088054 | Lead frame and method for manufacturing the same | Chi-Sheng Tseng, Ying-Chung Chen, Hui-Chung Liu | 2021-08-10 | $2,631,000 |
| 11081413 | Semiconductor package with inner and outer cavities | Hsin-Lin WU, Yu-Hsuan Tsai, Chang Chin Tsai, Ching-Han Huang | 2021-08-03 | $3,865,000 |
| 11014806 | Semiconductor device package and a method of manufacturing the same | Hsu-Liang Hsiao, Ching-Han Huang, Chia-Hung Shen | 2021-05-25 | $3,251,000 |
| 10916492 | Semiconductor substrate and method of manufacturing the same | Tsann Huei Lee | 2021-02-09 | $5,568,000 |