Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11174157 | Semiconductor device packages and methods of manufacturing the same | Chi-Sheng Tseng, Lu-Ming Lai, Yu-Hsuan Tsai, Hsin-Lin WU, San Yu | 2021-11-16 | $3,120,000 |