Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139193 | Device and method for positioning first object in relation to second object | Tetsuya Utano, Kohei Seyama | 2021-10-05 |
| 11024596 | Bonding apparatus and bonding method | Osamu Watanabe, Tomonori Nakamura, Toru Maeda, Satoru Nagai | 2021-06-01 |