Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183464 | Package substrate processing method and protective tape | Byeongdeck Jang | 2021-11-23 |
| 11164802 | Wafer manufacturing method and multilayer device chip manufacturing method | Akihito Kawai | 2021-11-02 |
| 11133198 | Method of manufacturing packaged device chip | Byeongdeck Jang | 2021-09-28 |
| 11114385 | Plate-shaped workpiece processing method | Byeongdeck Jang | 2021-09-07 |
| 10957593 | Method of processing a wafer | Yoshiteru Nishida, Hidekazu Iida, Kenta Chito | 2021-03-23 |
| 10957542 | Method of processing wafer | — | 2021-03-23 |
| 10937668 | Semiconductor package manufacturing method | Byeongdeck Jang | 2021-03-02 |