Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957593 | Method of processing a wafer | Hidekazu Iida, Kenta Chito, Youngsuk Kim | 2021-03-23 |
| 10896836 | Electrostatic chuck | Kenta Chito, Hidekazu Iida, Tomohiro Yamada, Hiroyuki Takahashi, Ryoko Fujiya +1 more | 2021-01-19 |