Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957593 | Method of processing a wafer | Yoshiteru Nishida, Hidekazu Iida, Youngsuk Kim | 2021-03-23 |
| 10910246 | Hold checking method and unhold checking method for wafer | — | 2021-02-02 |
| 10896836 | Electrostatic chuck | Hidekazu Iida, Tomohiro Yamada, Yoshiteru Nishida, Hiroyuki Takahashi, Ryoko Fujiya +1 more | 2021-01-19 |