Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957593 | Method of processing a wafer | Yoshiteru Nishida, Kenta Chito, Youngsuk Kim | 2021-03-23 |
| 10896836 | Electrostatic chuck | Kenta Chito, Tomohiro Yamada, Yoshiteru Nishida, Hiroyuki Takahashi, Ryoko Fujiya +1 more | 2021-01-19 |