Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183464 | Package substrate processing method and protective tape | Youngsuk Kim | 2021-11-23 |
| 11133198 | Method of manufacturing packaged device chip | Youngsuk Kim | 2021-09-28 |
| 11114385 | Plate-shaped workpiece processing method | Youngsuk Kim | 2021-09-07 |
| 10937668 | Semiconductor package manufacturing method | Youngsuk Kim | 2021-03-02 |