Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201139 | Semiconductor structure containing reentrant shaped bonding pads and methods of forming the same | Rahul Sharangpani, Raghuveer S. Makala, Adarsh Rajashekhar, Fei Zhou | 2021-12-14 |
| 11171097 | Bonded assembly containing metal-organic framework bonding dielectric and methods of forming the same | Ramy Nashed Bassely Said, Raghuveer S. Makala, Fei Zhou, Yao-Sheng Lee | 2021-11-09 |
| 11145628 | Semiconductor structure containing reentrant shaped bonding pads and methods of forming the same | Rahul Sharangpani, Raghuveer S. Makala, Adarsh Rajashekhar, Fei Zhou | 2021-10-12 |
| 11114406 | Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip | Raghuveer S. Makala, Yao-Sheng Lee, Jian Chen | 2021-09-07 |
| 10950629 | Three-dimensional flat NAND memory device having high mobility channels and methods of making the same | Raghuveer S. Makala, Fei Zhou, Yao-Sheng Lee | 2021-03-16 |
| 10910272 | Reusable support substrate for formation and transfer of semiconductor devices and methods of using the same | Fei Zhou, Raghuveer S. Makala | 2021-02-02 |