Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171097 | Bonded assembly containing metal-organic framework bonding dielectric and methods of forming the same | Ramy Nashed Bassely Said, Raghuveer S. Makala, Senaka Kanakamedala, Fei Zhou | 2021-11-09 |
| 11114406 | Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip | Senaka Kanakamedala, Raghuveer S. Makala, Jian Chen | 2021-09-07 |
| 10950629 | Three-dimensional flat NAND memory device having high mobility channels and methods of making the same | Raghuveer S. Makala, Fei Zhou, Senaka Kanakamedala | 2021-03-16 |