Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171097 | Bonded assembly containing metal-organic framework bonding dielectric and methods of forming the same | Raghuveer S. Makala, Senaka Kanakamedala, Fei Zhou, Yao-Sheng Lee | 2021-11-09 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171097 | Bonded assembly containing metal-organic framework bonding dielectric and methods of forming the same | Raghuveer S. Makala, Senaka Kanakamedala, Fei Zhou, Yao-Sheng Lee | 2021-11-09 |