Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201109 | Hermetic metallized via with improved reliability | Mandakini Kanungo, Prantik Mazumder, Chukwudi Azubuike Okoro, Ah-Young Park, Scott Christopher Pollard | 2021-12-14 |
| 11152294 | Hermetic metallized via with improved reliability | Tian Huang, Mandakini Kanungo, Ekaterina Aleksandrovna Kuksenkova, Prantik Mazumder, Chad Byron Moore +3 more | 2021-10-19 |
| 10957628 | Bottom up electroplating with release layer | Robert Alan Bellman | 2021-03-23 |