Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152317 | Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same | Ju-Il Choi, Hoechul Kim, Hoonjoo Na, Jaehyung Park, Seongmin Son | 2021-10-19 |
| 11121080 | Semiconductor device | Yuichiro Sasaki, Sungkeun Lim, Weonhong Kim, Seungha Oh, Yongho Ha +1 more | 2021-09-14 |