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Memory arrays and methods used in forming a memory array comprising strings of memory cells |
Daniel Billingsley, Indra V. Chary, Rita J. Klein |
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| 11177276 |
Conductive structures, assemblies having vertically-stacked memory cells over conductive structures, and methods of forming conductive structures |
Nancy M. Lomeli, Tom George, Scott M. Pook, John Mark Meldrim |
2021-11-16 |
| 11158718 |
Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material |
Rita J. Klein, Everett A. McTeer, John Mark Meldrim |
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| 11127899 |
Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnects |
Tao Nguyen, John Mark Meldrim, Aaron K. Belsher |
2021-09-21 |
| 11056505 |
Integrated assemblies having one or more modifying substances distributed within semiconductor material, and methods of forming integrated assemblies |
John D. Hopkins, Purnima Narayanan |
2021-07-06 |
| 11031417 |
Methods used in forming an array of elevationally-extending transistors |
John Mark Meldrim, E. Allen McTeer |
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| 11024644 |
Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies |
John D. Hopkins, Shyam Surthi |
2021-06-01 |
| 11011408 |
Memory arrays and methods used in forming a memory array comprising strings of memory cells |
Daniel Billingsley, Yongjun Jeff Hu |
2021-05-18 |
| 10957775 |
Assemblies having conductive structures with three or more different materials |
David Ross Economy, Rita J. Klein, John Mark Meldrim, Brenda D. Kraus, Everett A. McTeer |
2021-03-23 |
| 10943921 |
Methods of forming integrated assemblies |
Chet E. Carter, Collin Howder, John Mark Meldrim, Everett A. McTeer |
2021-03-09 |
