Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189629 | Integrated assemblies and methods of forming integrated assemblies | Richard J. Hill | 2021-11-30 |
| 11171153 | Integrated assemblies having improved charge migration | Byeung Chul Kim | 2021-11-09 |
| 11107830 | Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies | Byeung Chul Kim, Francois H. Fabreguette, Richard J. Hill | 2021-08-31 |
| 11081497 | Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies | Richard J. Hill, Byeung Chul Kim, Akira Goda | 2021-08-03 |
| 11081498 | Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies | Richard J. Hill | 2021-08-03 |
| 11037956 | Integrated assemblies having charge-trapping material arranged in vertically-spaced segments, and methods of forming integrated assemblies | Byeung Chul Kim, Francois H. Fabreguette, Richard J. Hill, Purnima Narayanan | 2021-06-15 |
| 11031414 | Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies | John D. Hopkins | 2021-06-08 |
| 11024644 | Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies | John D. Hopkins, Jordan D. Greenlee | 2021-06-01 |
| 10930652 | Apparatuses including buried digit lines | Suraj Mathew | 2021-02-23 |
| 10923480 | Capacitance reduction in a semiconductor device | Litao Yang, Gurtej S. Sandhu, Richard J. Hill | 2021-02-16 |