Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158718 | Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material | Jordan D. Greenlee, Rita J. Klein, John Mark Meldrim | 2021-10-26 |
| 10998481 | Ohmic contacts for semiconductor structures | Yongjun Jeff Hu, John Mark Meldrim, Shanming Mou | 2021-05-04 |
| 10957644 | Integrated structures with conductive regions having at least one element from group 2 of the periodic table | Christopher W. Petz | 2021-03-23 |
| 10957775 | Assemblies having conductive structures with three or more different materials | David Ross Economy, Rita J. Klein, Jordan D. Greenlee, John Mark Meldrim, Brenda D. Kraus | 2021-03-23 |
| 10943921 | Methods of forming integrated assemblies | Jordan D. Greenlee, Chet E. Carter, Collin Howder, John Mark Meldrim | 2021-03-09 |
| 10923657 | Methods of forming memory cells and memory devices | Tsz W. Chan, Durai Vishak Nirmal Ramaswamy, Qian Tao, Yongjun Jeff Hu | 2021-02-16 |
| 10916564 | Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars | David Ross Economy, John Mark Meldrim, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz +1 more | 2021-02-09 |