Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189662 | Memory cell stack and via formation for a memory device | Andrew Leslie Beemer | 2021-11-30 |
| 11158561 | Memory device with low density thermal barrier | Pengyuan Zheng, Yongjun Jeff Hu, Kent H. Zhuang, Robert K. Grubbs | 2021-10-26 |
| 11018298 | Phase change memory structures | Christopher W. Petz | 2021-05-25 |
| 10991425 | Access line grain modulation in a memory device | Stephen W. Russell | 2021-04-27 |
| 10964621 | Memory device with high resistivity thermal barrier | Pengyuan Zheng | 2021-03-30 |
| 10957775 | Assemblies having conductive structures with three or more different materials | Rita J. Klein, Jordan D. Greenlee, John Mark Meldrim, Brenda D. Kraus, Everett A. McTeer | 2021-03-23 |
| 10916564 | Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars | John Mark Meldrim, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley +1 more | 2021-02-09 |