Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127899 | Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnects | Jordan D. Greenlee, Tao Nguyen, John Mark Meldrim | 2021-09-21 |
AB
Aaron K. Belsher
Overall (2021): #546,762 of 548,734Top 100%
1
Patents 2021