Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211359 | Semiconductor device and method of forming modular 3D semiconductor package with horizontal and vertical oriented substrates | Michael J. Seddon | 2021-12-28 |
| 11049833 | Semiconductor packages with an intermetallic layer | Michael J. Seddon | 2021-06-29 |
| 10971428 | Semiconductor baseplates | Atapol Prajuckamol, Chee Hiong CHEW, Yushuang YAO | 2021-04-06 |
| 10950534 | Through-substrate via structure and method of manufacture | Michael J. Seddon | 2021-03-16 |
| 10916485 | Molded wafer level packaging | Soon Wei WANG, Jin Yoong LIONG, Chee Hiong CHEW | 2021-02-09 |
| 10903154 | Semiconductor device and method of forming cantilevered protrusion on a semiconductor die | Michael J. Seddon | 2021-01-26 |
| 10897821 | Method of making single reflow power pin connections | Yushuang YAO, Atapol Prajuckamol, Chee Hiong CHEW, Yusheng LIN | 2021-01-19 |