Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069601 | Leadless semiconductor package with wettable flanks | Ian Harvey Arellano, Aaron Cadag | 2021-07-20 |
| 10957634 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Rammil Seguido | 2021-03-23 |
| 10910295 | QFN pre-molded leadframe having a solder wettable sidewall on each lead | Aaron Cadag, Ernesto Antilano, Jr. | 2021-02-02 |
| 10903172 | Package with interlocking leads and manufacturing the same | Aaron Cadag, Lester Joseph Belalo | 2021-01-26 |