Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152326 | Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame | Rennier Rodriguez, Raymond Albert Narvadez, Michael Tabiera | 2021-10-19 |
| 11004776 | Semiconductor device with frame having arms and related methods | Jefferson Talledo | 2021-05-11 |
| 10957634 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag | 2021-03-23 |