Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152326 | Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame | Rammil Seguido, Raymond Albert Narvadez, Michael Tabiera | 2021-10-19 |
| 11037864 | Lead frame for improving adhesive fillets on semiconductor die corners | Maiden Grace Maming, Jefferson Talledo | 2021-06-15 |
| 10957634 | Modified leadframe design with adhesive overflow recesses | Aiza Marie Agudon, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2021-03-23 |
| 10892212 | Flat no-lead package with surface mounted structure | Aiza Marie Agudon, Maiden Grace Maming | 2021-01-12 |