Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133241 | Semiconductor package with a cavity in a die pad for reducing voids in the solder | — | 2021-09-28 |
| 11037864 | Lead frame for improving adhesive fillets on semiconductor die corners | Rennier Rodriguez, Maiden Grace Maming | 2021-06-15 |
| 11031350 | Leadframe with pad anchoring members and method of forming the same | — | 2021-06-08 |
| 11004776 | Semiconductor device with frame having arms and related methods | Rammil Seguido | 2021-05-11 |
| 10957634 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Aiza Marie Agudon, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2021-03-23 |
| 10943885 | Method for making semiconductor device with sidewall recess and related devices | — | 2021-03-09 |