Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037864 | Lead frame for improving adhesive fillets on semiconductor die corners | Rennier Rodriguez, Jefferson Talledo | 2021-06-15 |
| 10892212 | Flat no-lead package with surface mounted structure | Rennier Rodriguez, Aiza Marie Agudon | 2021-01-12 |