Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069601 | Leadless semiconductor package with wettable flanks | Ian Harvey Arellano, Ela Mia Cadag | 2021-07-20 |
| 10910295 | QFN pre-molded leadframe having a solder wettable sidewall on each lead | Ernesto Antilano, Jr., Ela Mia Cadag | 2021-02-02 |
| 10903172 | Package with interlocking leads and manufacturing the same | Lester Joseph Belalo, Ela Mia Cadag | 2021-01-26 |