Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189598 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | HunTeak Lee, Sungsoo Kim, HeeSoo Lee | 2021-11-30 |
| 11145603 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2021-10-12 |
| 11024585 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2021-06-01 |
| 10937741 | Molded laser package with electromagnetic interference shield and method of making | HunTeak Lee, HeeSoo Lee, Wanil Lee, SANGDUK LEE | 2021-03-02 |