Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211356 | Power semiconductor package and method for fabricating a power semiconductor package | Wee Aun Jason Lim, Paul Armand Asentista Calo, Ting Soon Chin, Chooi Mei Chong, Sanjay Kumar Murugan +1 more | 2021-12-28 |
| 10886199 | Molded semiconductor package with double-sided cooling | Chau Fatt Chiang, Swee Kah Lee, Josef Maerz, Thomas Stoek | 2021-01-05 |