Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211356 | Power semiconductor package and method for fabricating a power semiconductor package | Paul Armand Asentista Calo, Ting Soon Chin, Chooi Mei Chong, Sanjay Kumar Murugan, Ying Pok Sam +1 more | 2021-12-28 |