Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171117 | Interlayer connection of stacked microelectronic components | Guilian Gao | 2021-11-09 |
| 11158606 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar | 2021-10-26 |
| 11063017 | Embedded organic interposer for high bandwidth | Javier A. Delacruz | 2021-07-13 |
| 11024220 | Formation of a light-emitting diode display | Liang Wang, Rajesh Katkar, Javier A. Delacruz, Ilyas Mohammed | 2021-06-01 |
| 11004930 | High density three-dimensional integrated capacitors | Vage Oganesian, Ilyas Mohammed, Piyush Savalia | 2021-05-11 |
| 10991676 | Systems and methods for flash stacking | Ilyas Mohammed, Javier A. Delacruz | 2021-04-27 |
| 10969593 | Remote optical engine for virtual reality or augmented reality headsets | Ilyas Mohammed, Rajesh Katkar | 2021-04-06 |
| 10955671 | Stretchable film assembly with conductive traces | Ilyas Mohammed, Gabriel Z. Guevara, Min Tao | 2021-03-23 |
| 10923408 | Cavity packages | Shaowu Huang, Javier A. Delacruz, Liang Wang, Rajesh Katkar | 2021-02-16 |
| 10910344 | Systems and methods for releveled bump planes for chiplets | Javier A. Delacruz, Cyprian Emeka Uzoh, Rajesh Katkar, Ilyas Mohammed | 2021-02-02 |