Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11128301 | High-speed core interconnect for multi-die programmable logic devices | Ankireddy Nalamalpu, Dheeraj Subbareddy | 2021-09-21 |
| 11080449 | Modular periphery tile for integrated circuit device | Chee Hak Teh, Ankireddy Nalamalpu, MD Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt | 2021-08-03 |
| 11062070 | Die to die interconnect structure for modularized integrated circuit devices | Chee Hak Teh | 2021-07-13 |
| 11036660 | Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devices | George Chong Hean Ooi, Chee Hak Teh | 2021-06-15 |
| 10886218 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Hak Teh, Chee Seng Leong, Han Wooi Lim, Hee Kong Phoon | 2021-01-05 |