Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121109 | Innovative interconnect design for package architecture to improve latency | Ankireddy Nalamalpu, Dheeraj Subbareddy | 2021-09-14 |
| 11080449 | Modular periphery tile for integrated circuit device | Chee Hak Teh, Ankireddy Nalamalpu, Dheeraj Subbareddy, Sean R. Atsatt, Lai Guan Tang | 2021-08-03 |
| 11070209 | Programmable logic device with fine-grained disaggregation | Dheeraj Subbareddy, Ankireddy Nalamalpu, Robert Sankman, Ravindranath V. Mahajan, Gregg William Baeckler | 2021-07-20 |
| 11056452 | Interface bus for inter-die communication in a multi-chip package over high density interconnects | Dheeraj Subbareddy, Ankireddy Nalamalpu | 2021-07-06 |
| 10980134 | Method for orienting solder balls on a BGA device | Scott Gilbert | 2021-04-13 |
| 10950537 | Land side and die side cavities to reduce package z-height | Scott Gilbert | 2021-03-16 |