Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11128301 | High-speed core interconnect for multi-die programmable logic devices | Lai Guan Tang, Ankireddy Nalamalpu | 2021-09-21 | $30,488,000 |
| 11121109 | Innovative interconnect design for package architecture to improve latency | MD Altaf Hossain, Ankireddy Nalamalpu | 2021-09-14 | $31,644,000 |
| 11080449 | Modular periphery tile for integrated circuit device | Chee Hak Teh, Ankireddy Nalamalpu, MD Altaf Hossain, Sean R. Atsatt, Lai Guan Tang | 2021-08-03 | $25,424,000 |
| 11070209 | Programmable logic device with fine-grained disaggregation | MD Altaf Hossain, Ankireddy Nalamalpu, Robert Sankman, Ravindranath V. Mahajan, Gregg William Baeckler | 2021-07-20 | $44,320,000 |
| 11056452 | Interface bus for inter-die communication in a multi-chip package over high density interconnects | Ankireddy Nalamalpu, MD Altaf Hossain | 2021-07-06 | $31,309,000 |