Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10980134 | Method for orienting solder balls on a BGA device | MD Altaf Hossain | 2021-04-13 |
| 10950537 | Land side and die side cavities to reduce package z-height | MD Altaf Hossain | 2021-03-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10980134 | Method for orienting solder balls on a BGA device | MD Altaf Hossain | 2021-04-13 |
| 10950537 | Land side and die side cavities to reduce package z-height | MD Altaf Hossain | 2021-03-16 |