Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10980134 | Method for orienting solder balls on a BGA device | MD Altaf Hossain | 2021-04-13 | $58,007,000 |
| 10950537 | Land side and die side cavities to reduce package z-height | MD Altaf Hossain | 2021-03-16 | $38,556,000 |