Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11043942 | Variable delay circuits and methods | — | 2021-06-22 | $40,504,000 |
| 10886218 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Hak Teh, Lai Guan Tang, Han Wooi Lim, Hee Kong Phoon | 2021-01-05 | $27,050,000 |