Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10886218 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Hak Teh, Chee Seng Leong, Lai Guan Tang, Han Wooi Lim | 2021-01-05 |
HP
Hee Kong Phoon — 1 Patent in 2021
Overall (2021): #436,185 of 548,734Top 80%
1
Patents 2021