Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10886218 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Hak Teh, Chee Seng Leong, Lai Guan Tang, Han Wooi Lim | 2021-01-05 | $27,050,000 |