Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978418 | Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more | 2021-04-13 |
| 10930772 | IGBT having a barrier region | Alexander Philippou, Christian Jaeger, Johannes Georg Laven | 2021-02-23 |
| 10910487 | Power semiconductor device having trench electrodes biased at three different electrical potentials, and method of manufacturing the same | Alexander Philippou, Christian Jaeger, Johannes Georg Laven, Max Christian Seifert | 2021-02-02 |