Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152214 | Structures and methods for equivalent oxide thickness scaling on silicon germanium channel or III-V channel of semiconductor device | Takashi Ando, Eduard A. Cartier, Martin M. Frank, Vijay Narayanan, John Rozen | 2021-10-19 |
| 11101219 | Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements | Jack O. Chu, Kam-Leung Lee, Ahmet S. Ozcan, Paul M. Solomon, Jeng-Bang Yau | 2021-08-24 |
| 10985105 | Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements | Jack O. Chu, Kam-Leung Lee, Ahmet S. Ozcan, Paul M. Solomon, Jeng-Bang Yau | 2021-04-20 |